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TL21W02-L1(t34 2011-04-11 1 wl-0755 tentative TL21W02-L1( t34 ~???xz
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? -??o ?xz? ?t7 4?7? ]?y?z?b7s&m?`?b{ ~???wh~ ?w??xz??s m?os&m?`?b{ ~ this material is technological examinat ion material to aim at the product introduction. the change in the c ontent of the characteristic might be accompanied at the final specificat ion process. the final specification will be able to be gotten in the br okerage department when the product is designed and to get the confirmation. ~ please do not open this material to the third person. for part availability and ordering information please call toll free: 800.984.5337 website: www.marktechopto.com | email: info@marktechopto.com optoelectronics marktech
TL21W02-L1(t34 2011-04-11 2 wl-0755 tentative toshiba led lamps TL21W02-L1(t34 surface-mount devices ? 2.1 (l) mm 2.5 (w) mm 0.65 (h ) mm size ? high luminous flux led: 42 lm(typ.) @if=150 ma ? color: white (3000k) ? high color rendering index : ra=85 (typ.) ? reflow-soldering is available ? applications : general lighting and etc. color and material part number color material TL21W02-L1 white (3000k) ingan absolute maximum ratings (ta = 25c) (note.1) characteristics symbol rating unit forward current (note.2) i f (180) ma pulse current (note.3) i fp (300) ma power dissipation p d 0.76 w operating temperature t opr ?4 0 to 100 c storage temperature t stg ? 40 to 100 c junction temperature tj 120 c note 1: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this pr oduct to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 2: the junction-to-ambient thermal resistance, rth(j-a), should be kept below 70 ? /w so that the TL21W02-L1(t34 is not exposed to a condition beyond the absolute maximu m ratings. rth(j-a): thermal resistance from the led junction to ambient temperature note 3: pulse width 10ms, duty 1/10 unit: mm (0.3) 0.45 1.55 1.8 0.65 2.1 2.5 (0.3) 0.45 1.55 1.8 0.65 2.1 2.5 1. cathode 2. anode jedec D jeita D toshiba 4-2j1 weight: **** g (typ.) ambient temperature ta (c) allowable forward current i f (ma) i f ? ta 1 2 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 rth(j-a)=70 ? /w optoelectronics marktech for part availability and ordering info rmation please call to ll free: 800.984.5337 website: www.marktechopto.com | email: info@marktechopto.com
TL21W02-L1(t34 2011-04-11 3 wl-0755 tentative electrical characteristics (ta 25c) note 4: v f rank classification the specification on the following table is used for v f classification of leds in toshiba facility. each reel includes the same rank leds. let the delivery ratio of each rank be unquestioned. note 5: rth(j-s): thermal resistance from the led junction to solder point. optical characteristics (ta 25c) note 6: chromatici ty classification the product is classified at the following chromaticity coordinate groups. each reel includes the same rank leds. let the delivery ratio of eac h rank be unquestioned. characteristics symbol test condition min typ. max unit forward voltage (note 4) v f i f 150 ma (2.9) (3.25) (3.8) v reverse voltage v r i r 1 ma 0.75 v thermal resistance (note 5) rth(j-s) i f 150 ma (20) c w forward voltage v f part number min typ. max i f TL21W02-L1(t34 ? (2.9) (3.25) (3.8) 1 2.9 3.2 2 3.2 3.5 3 3.5 3.8 150 unit v ma characteristics symbol test condition min typ. max unit c x i f 0 ma (note 6) chromaticity c y i f 0 ma (note 6) color temperature cct i f 0 ma 3000 k luminous flux (note 7) v i f 0 ma (30.3) (42) (60.5) lm color rendering index ra i f 0 ma 85 cx cy 0.4147 0.3814 0.4221 0.3984 0.4342 0.4028 7a 0.4259 0.3853 0.4221 0.3984 0.4299 0.4165 0.443 0.4212 7b 0.4342 0.4028 0.4342 0.4028 0.4430 0.4212 0.4562 0.426 7c 0.4465 0.4071 0.4259 0.3853 0.4342 0.4028 0.4465 0.4071 7d 0.4373 0.3893 3220k 3000k 2870k 0.36 0.37 0.38 0.39 0.40 0.41 0.42 0.43 0.44 0.45 0.39 0.40 0.41 0.42 0.43 0.44 0.45 0.46 0.47 0.48 cx cy "/4*$ 7a 7b 7c 7d test conditions: i f =150 ma, ta=25c tolerance: +/-0.1v tolerance: r 0.01 ta=25c
TL21W02-L1(t34 2011-04-11 4 wl-0755 tentative note 7: v rank classification the specification on the following table is used for f classification of leds in toshiba facility. each reel includes the same rank leds. let the delivery ratio of each rank be unquestioned. note 8: color rendering index measurement tolerance : +/- 5 cautions x the product is sensitive to electrosta tic and care must be fully taken when handling products. particularly in the case that an over-voltage shall be applied, the overflowed energy may ca use damage to or possibly result in destruction of the product. users sh all take absolutely secure countermeasures against electrostatic and surge when handling the product. x this product is designed as a general display light sou rce usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. ther efore, it is not intended for usage of functional application (ex. light source for sensor, optical communi cation and etc) except general display light source. x please note the handling of products during evaluation. 1. please do not apply pressure to the upper surface of the product with finger, tweezers, and others. failure of product to light up may occur due to package deform ation, wire deformation and/or disconnection. 2. should tweezers be used in product handling, one with flat surfaces is recommended. 3. please handle the product widthwise. 4. please do not drop the product. th ere is a possibility for package transfor mation etc. to occu r when the product is dropped. 5. please do not stack the printed circuit boards on wh ich the product is mounted to prevent damages to product surface. also, please note not to da mage the surface of the product with cushioning material etc. surface damage to the product may influence their optical characteristics. luminous flux v part number min typ. max i f TL21W02-L1(t34 (30.3) (42) (60.5) c16 30.3 36.0 c17 36.0 42.8 c18 42.8 51.0 c19 51.0 60.5 150 unit lm ma ta=25c tolerance: +/-10%
TL21W02-L1(t34 2011-04-11 5 wl-0755 tentative packaging this led device is packed in an aluminum envelope with a silica gel an d a moisture indicator to avoid moisture absorption. the optical characteristics of the device may be affected by exposure to moisture in the air before soldering and the device should therefore be stored under the following conditions: 1. this moisture proof bag may be stored unopene d within 12 months at the following conditions. temperature: 5 q c~30 q c humidity: 90% (max) 2. after opening the moisture proof bag, the device should be assembled within 168 hours in an environment of 5c to 30c/60% rh or below. 3. if upon opening, the moisture in dicator card shows humidity 30% or above (color of indication changes to pink) or the expiration date has passed, the de vice should be baked in taping with reel. after baking, use the baked device within 72 hours, but perform baking only once. baking conditions: 60 r 5c, for 24 to 48 hours. expiration date: 12 months from sealing date , which is imprinted on the label affixed. 4. repeated baking can cause the pee ling strength of the taping to change , then leads to trouble in mounting. 5. if the packing material of laminate would be broken , the hermeticity would deteriorate. therefore, do not throw or drop the packed devices. mounting method soldering x reflow soldering (example) x the product is evaluated using above re flow soldering conditions. no addition al test is performed exceed the condition (i.e. the condition more than (*)max values) as a evaluation. please perform reflow soldering under the above conditions. x please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. x second reflow soldering in case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. storage conditions before the second reflow soldering: 30 q c, 60% rh (max) x when any soldering corrections are made manually,a hot- plate should be used and do not use soldering iron. (only once at each soldering point) x do not perform wave soldering. land pattern dimensions for reference only 60~120 s 10 s max 240 q c max 4 q c/s max 140~160 q c 4 q c/s max time (s) package surface temperature ( q c) temperature profile for pb soldering (example) time (s) package surface temperature ( q c) temperature profile for pb-free soldering (example) 150~180 q c 4 q c/s max 5 s max 260 q c max 4 q c/s max 230 q c 60~120 s (*) (*) (*) (*) (*) (*) (*) (*) max (*) max (*) max (*) 30~50s max (*) max (*) unit : mm 0.3 0.45 1.55 1.8
TL21W02-L1(t34 2011-04-11 6 wl-0755 tentative cleaning when cleaning is required after soldering, tosh iba recommends the following cleaning solvents. it is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). in selecting the one for your actual usage, please perform sufficient review on washing condition, us ing condition and etc. asahi clean ak-225aes : (made by asahi glass) kao clean trough 750hs : (made by kao) pine alpha st-100s : (made by arakawa chemical) precautions when mounting do not apply force to the plastic part of the led under high-temperature conditions. to avoid damaging the led plastic, do not apply friction using a hard material. when installing the pcb in a product, ensure that the device does not come into contact with other components. tape specifications 1. product number format the type of package used for shipment is denote d by a symbol suffix after the product number. the method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard toshiba specifications) (1) tape type: t34 (8-mm pitch) (2) example 2. tape dimensions unit: mm symbol dimension tolerance symbol dimension tolerance d 1.5 0.1/ 0 p 2 2.0 r 0.05 e 1.75 r 0.1 w 8.0 r 0.2 p 0 4.0 r 0.1 p 8.0 r 0.1 t 0.3 r 0.05 a 0 (2.4) r 0.1 f 3.5 r 0.05 b 0 (2.8) r 0.1 d 1 1.1 r 0.1 k 0 0.8 r 0.05 TL21W02-L1 (t34 tape type toshiba product no. p d 1 f e w ?
q t k 0 b 0 d p 2 p 0 a 0
TL21W02-L1(t34 2011-04-11 7 wl-0755 tentative 3. reel dimensions unit: mm 4. leader and trailer sections of tape 9 180 0 4 i 60 i 13 11.4 r 1.0 2 r 0.5 i 44 leading part: 190 mm (min) 40 mm or more 40 mm or more
TL21W02-L1(t34 2011-04-11 8 wl-0755 tentative 5. packing form (1) packing quantity reel 1,000 pcs carton 5,000 pcs (2) packing form: each reel is sealed in an aluminum pack with silica gel. 6. label format (1) example : TL21W02-L1(t34 p/n: toshiba type TL21W02-L1(t34 addc xxx q?ty 1,000 pcs xxxxxx xxxxxxxx xxx xxxx (xxxxx) xxxxxxxxxx use under 5-30degc/60%rh within 168h sealed: [[g]]/rohs compatible diffused in xxxxx *y380xxxxxxxxxxxxxxxxxx* assembled in xxxxx (1)-1 contents about note section (each ex ample means the contents are different for each lot.) information for customers use information for toshiba use 1) lot code example: 2707c2b 4) management code example: 015 32g 2) key code example: 12345 5) packing quantity example: 1000 3) rank symbol example: 7ac172 6) product information (refer to section (1)-2) exxxx 7) storage condition after opening use under 5-30 degc/60%rh within 168h (1)-2 explanations for ?addc? and ?product information? addc product information assembled in domestic : (l1 xxx assembled in overseas : (l2 xxx (2) label location 1) 2) 4) 5) 3) 6) 7) tape feel direction label position label position x reel x carton x the aluminum package in which the reel is supplied also has the label attached to center of one side.
TL21W02-L1(t34 2011-04-11 9 wl-0755 tentative restrictions on product use x toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. x this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. x though toshiba works continually to improve product's quality a nd reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest ve rsions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and applicat ion notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications , including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. x product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. x do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. x product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. x the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. x absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. x do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. x please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba a ssumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

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